Industry Patents
Patent: 8080819
LED Package Methods and Systems
(Click image for PDF of full patent)
| Patent Number: |
8080819 |
| Title: |
LED Package Methods and Systems |
| Abstract: |
Methods and systems are provided for LED modules that include an LED die
integrated in an LED package with a submount that includes an electronic
component for controlling the light emitted by the LED die. The
electronic component integrated in the submount may include drive
hardware, a network interface, memory, a processor, a switch-mode power
supply, a power facility, or another type of electronic component.
|
| Country of Issue: |
US |
| First Named Inventor: |
Mueller, Dowling, Morgan, Lys |
| Assignee: |
Philips SSL |
| Continuation or Divisional of: |
7646029 |
| International Classification: |
H01L 29/06 |
| US Classification: |
257/13 |
| Issue Date: |
12-20-2011 |
| Filing Date: |
12-04-2009 |
| Application : |
12/631266 |
| Notes: |
|
| Link to Patent at freepatentsonline.com: |
8080819 at Freepatentsonline |
| Link to World Patent Family1: |
World Patent Family at European Patent Office |
| Link to Google Patents1: |
8080819 at Google Patents |
1. The Google Patents and World Patent Family links will likely not work until a few weeks
after the patent has issued - they take a while to get new patents in their systems.
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