Industry Patents
Patent: 6849943
Power Module Package for High Frequency Switching System
(Click image for PDF of full patent)
| Patent Number: |
6849943 |
| Title: |
Power Module Package for High Frequency Switching System |
| Abstract: |
A heat sink with fins has a flat, planar surface soldered to a metallic
layer at one surface of a flat, planar ceramic layer. The opposite surface
of the ceramic layer has a metallic pattern including base areas for high
power, high frequency load switching MOSFETs. Lead frames are soldered
between the lead frame base areas and base contact areas of the MOSFET
packages. Thermal conduction between the MOSFETs and the heat sink
dissipates the heat from switching losses. A gate drive circuit board for
the load switching system is supported spaced from the and is separated
from the MOSFETs by a thermally blocking air gap, with the component side
of the gate drive circuit board facing away from the MOSFETs. Spade
terminals of the lead frames extend through openings in the gate drive
circuit board to route high power signals independently of the gate driver
circuit board.
|
| Country of Issue: |
US |
| First Named Inventor: |
Thurk, Suomi, Brunker |
| Assignee: |
Electronic Theatre Controls |
| Continuation or Divisional of: |
|
| International Classification: |
H01L 23/34 |
| US Classification: |
257/712 |
| Issue Date: |
02-01-2005 |
| Filing Date: |
06-06-2003 |
| Application : |
10/457067 |
| Notes: |
|
| Link to Patent at freepatentsonline.com: |
6849943 at Freepatentsonline |
| Link to World Patent Family1: |
World Patent Family at European Patent Office |
| Link to Google Patents1: |
6849943 at Google Patents |
1. The Google Patents and World Patent Family links will likely not work until a few weeks
after the patent has issued - they take a while to get new patents in their systems.
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